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    • 专利摘要:
    Realization of a thermal absorption device comprising a first face intended to be in contact with a hot source and a second face opposite to the first face, an array of cells (8) filled with a first phase-change material ( 12) being disposed between the first face, a cell passage (9) being filled with at least one second phase change material (14) different from the first phase change material (12).
    公开号:FR3046021A1
    申请号:FR1562602
    申请日:2015-12-17
    公开日:2017-06-23
    发明作者:Ulrich Soupremanien；Emmanuel Ollier
    申请人:Commissariat a lEnergie Atomique CEA；Commissariat a lEnergie Atomique et aux Energies Alternatives CEA；
    IPC主号:
    专利说明:

    COMPOSITE THERMAL ABSORPTION DEVICE AND METHOD OF OBTAINING
    DESCRIPTION
    TECHNICAL FIELD AND PRIOR ART
    The present invention relates to the implementation of an improved thermal absorption device that can be used for example for cooling electronic components.
    In electronic devices, are confined a number of more and more important features. We simultaneously seek to reduce the size of these components. This trend leads to the need to dissipate a growing amount of heat per unit volume (or mass) component.
    The problem of heat dissipation is particularly important in 3D devices whose electronic components (for example memory cells) are distributed over several levels and dimensions or in electronic power devices.
    In addition to the larger amount of heat to be evacuated, there is the problem of heat dissipation in transient mode, when the heat flow is relatively high and the duration of the charge is relatively short.
    The implementation of thermal absorption devices with a phase change material (PCM) is known. These materials make it possible to store significant quantities of heat because of their phase transition, typically from a solid state to a liquid state.
    The document "A carbon nanotube-based composite for the thermal control of heat loads", by Shaikh et al., Carbon, Elsevier, Volume 50, Issue 2, 2012, pages 542-550 discloses a thermal management device arranged between a source and a cold source and formed of a stack of compartments, each compartment being provided with a wall enclosing a phase change material.
    Such a type of device is only suitable for the thermal management of a uniform heat source.
    SUMMARY OF THE INVENTION It is an object of the present invention to provide an effective thermal absorption device for evacuating heat from a non-uniform heat source and in particular formed of elements liable to undergo different heating, this a hot source being, for example, an electronic device with juxtaposed components having different operating temperature ranges or different operating critical temperatures. By different operating temperature ranges is meant that when these components are in operation their respective dissipated power are not the same.
    In one aspect, the present invention relates to a thermal absorption device comprising cells containing a first solid / liquid phase change material, and a passage between cells containing a second solid / liquid phase change material, the first material and the second phase-change material being distributed in the same plane parallel to a face of the thermal absorption device intended to be placed in thermal contact with the hot source, for example in the form of a plurality of juxtaposed components.
    One embodiment of the present invention provides a thermal absorption device having a first face intended to be in contact with a hot source and a second face opposite to the first face, an array of cells filled with a first material to change phase being disposed between the first face and the second face, at least a first cell and at least a second cell of the array being disposed in a same plane parallel to the first face, the first cell having a first side wall which extends between the first face and the second face while the second cell comprises at least a first side wall which extends between the first face and the second face, the array of cells being arranged so that a passage is provided between the first face and the second face; side wall and the second side wall and that passage is filled with at least one second phase-change material e different from the first phase change material.
    Cells filled with the first phase change material (PCM) may be provided to effect thermal clipping of a first element of the hot source, while the passage between cells and filled with the second phase change material (PCM) ) can be dedicated to performing a thermal clipping of a second element of the hot source having a temperature operating range different from that of the first element.
    Thus, a composite structure with 2 (or more) phase change materials capable of absorbing heat by enthalpy of phase change at at least two different temperatures is implemented.
    Advantageously, the first side wall and the second side wall are formed of carbon nanotubes.
    Thanks to their good thermal conductivity, the nanotubes provide a heat dissipation in nominal regime by conduction. The nanotubes are preferably in contact with each other so that the walls of the cells are of dense material.
    Advantageously, at least the first cell comprises several distinct channels which extend between the first face and the second face and are filled with the second phase-change material.
    A structure with several channels per cell has in particular improved mechanical strength.
    Preferably, the first phase-change material located in the cells has a first melting temperature TF1 while the second phase-change material has a second melting temperature TF2, the second melting temperature TF2 being lower than the first temperature TF1 merger.
    The first phase change material may be an organic material. The first material is preferably chosen so as to have, in its liquid form, a low viscosity and a high affinity with the material forming the cells. By "low" viscosity is meant a viscosity typically less than 1000 centipoise (cP). By "high affinity" is meant in particular that the material in its liquid form has a good wettability, that is to say such that a contact angle of typically less than 60 ° and in particular 45 ° is established with the material forming the cells.
    Thus, the first phase change material can be advantageously a paraffin, especially when the cells are carbon nanotubes.
    The second phase change material may be an organic or inorganic material, preferably having a good thermal conductivity such as a metallic material.
    A structure provided with several channels per cell may make it possible to integrate a material with organic phase change and possibly little thermal conductor, the thermal conduction then being carried out mainly by the walls of the channels, in particular when these are made of carbon nanotubes. .
    According to another aspect, the present invention relates to an electronic system comprising: at least one first electronic component forming a first heat source, at least one second electronic component forming a second heat source, at least one absorption device. thermal as defined above, the first electronic component and the second electronic component being in thermal contact with the first face of the thermal absorption device.
    According to another aspect, the present invention relates to a method of manufacturing a thermal management device as defined above.
    This method may comprise steps of: a) filling at least a first cell and at least a second cell of the network with the first phase-change material in its liquid state, then b) filling with the second material to phase change in its liquid state of a passage located between the first cell and the second cell.
    The cells may have distinct channels of critical size smaller than the critical dimension of the passage between the first cell and a second cell.
    In this case, the selective filling of the channels by the first phase-change material in step a) is facilitated.
    By "critical dimension" of a pattern is meant here and throughout the present description the smallest dimension of a pattern except its thickness or height.
    When the first phase change material has a first melting temperature higher than the melting temperature of the second phase change material, the filling in step b) is advantageously carried out at a temperature below the melting temperature of the first phase change material. phase change material.
    In this case, it is avoided to damage the first phase change material.
    Prior to step a), the manufacturing method may comprise steps of: - definition of a pattern of the network of cells in a masking formed (in particular by photolithography) on a support, then - deposition of a layer of catalyst, then - removal of the masking, and then - growth of carbon nanotubes so as to define the cell network with side walls in carbon nanotubes.
    BRIEF DESCRIPTION OF THE DRAWINGS
    The present invention will be better understood on reading the description of exemplary embodiments given, purely by way of indication and in no way limiting, with reference to the appended drawings in which: FIGS. 1A and 1B are views in longitudinal and transverse section respectively a schematic representation of an exemplary embodiment of a thermal absorption device according to the invention; FIGS. 2A to 2H are schematic representations of steps for producing the thermal absorption device when it is formed of a network of cells made of carbon nanotubes; FIG. 3 is a time-temperature curve serving to illustrate the performances of a device equipped with several phase-change materials; FIG. 4 is a cross-sectional view of an exemplary system provided with a multiple phase change material thermal absorption device according to the invention on one side of which several electronic components having different operating ranges and different critical operating temperatures are arranged; FIG. 5 serves to illustrate the performance of such a system in comparison with a device incorporating a single phase-change material.
    In addition, in the following description, terms which depend on the orientation of the device, such as "lateral", "upper", "lower", apply considering that the structure is oriented as illustrated on the figures.
    Identical, similar or equivalent parts of the different figures bear the same numerical references so as to facilitate the passage from one figure to another.
    The different parts shown in the figures are not necessarily in a uniform scale, to make the figures more readable.
    DETAILED PRESENTATION OF PARTICULAR EMBODIMENTS
    An exemplary embodiment of a thermal absorption device according to the invention will now be described in connection with Figures IA and IB (giving respectively a top view and a cross-sectional view of the device).
    This device is intended to be disposed on an element (not shown) called a "hot source" which one wishes to manage the heating. For example, the hot source is an electronic device provided with at least one electronic component, such as a memory, a processor, a planar or 3D integrated circuit, a power electronics component. As an example of a power component, mention may be made in particular of thyristors of the GTO type (of the English "Turn-Off Thyristor") or bipolar transistors with insulated gate (IGBT, of the English "Insulated Trigger Bipolar Transistor ") or thyristors IGCT (for" Integrated Gate-Commutated Thyristor ").
    The thermal absorption device has a substantially planar shape and has a first face 4 intended to be in contact with the hot source and a second face 6 opposite to the first face 4. The second face 6 of the thermal absorption device is suitable to be arranged on another element (not shown) such as a support, for example PCB type (for "Printed circuit board"), this support may itself be attached to a heat sink device also called cooling device. Typically, the cooling device is a finned radiator or a fluidic channel structure. A heat flux F is thus intended to propagate from the first face 4 to the second face 6.
    In the example of FIGS. 1A-1B, the first and second faces 4, 6 extend in a direction substantially parallel to a plane [0; x; y] an orthogonal reference [0; x; there; z].
    The heat absorbing device is formed of a network of distinct cells 8 (also called "islands") delimited by lateral walls 10 which extend between the first face 4 and the second face 6, in this example substantially orthogonal at the first face 4 and the second face 6. Advantageously, the side walls 10 are made of carbon nanotubes. These have a high coefficient of thermal conductivity, for example between 6 W.cm_1.K1 to 20 W.cm-l.K'1. The walls 10 are formed in such a way that the nanotubes form a dense material in which the nanotubes are in contact with one another via their lateral surface.
    The cells 8 each have at least one cavity, also called a "channel". In this example, the cells are advantageously provided with several separate channels 11 which extend parallel to the side walls 10 between the first face 4 and the second face 6, ie substantially in the direction of the heat flow. The channels 11 are made between partitions 13 made of carbon nanotubes and form reservoirs for at least one first phase-change material 12 (MCP). In the present example, the channels 11 are provided with a cylindrical shape which, as will be seen later, may make it possible to promote their filling by the first phase change material (PCM) 12.
    The length of the channels 11 (measured parallel to the z axis in the example given in the figures) is substantially equal to or close to that of the carbon nanotubes. This length can be for example between 5 pm and 1000 pm. The channels 11 have a critical dimension Δι (dimension measured parallel to the first face or the plane [0; x; y]) which may be for example between 5 μm and 50 μm, preferably of the order of 10 μm. The channels 11 may be separated from each other by a distance of close to the critical dimension of channel aids, this distance being capable of being for example between 5 μm and 50 μm.
    In the example of FIGS. 1A and 1B, the cells 8 have a hexagonal shape, the network having a honeycomb shape. In this case, cells with a section D (distance between two opposite side walls, that is to say between two opposite faces of the hexagon), for example between 50 μm and 1000 μm, or for example the order of 410 pm or 610 pm.
    This form of cells 8 is not exclusive, and a network in the form of square or rectangular cells, or circular is not beyond the scope of the present invention. The honeycomb structure has the advantage of offering good mechanical strength. In the example shown, the cells 8 are all the same size, however one could expect cells of different sizes and / or different shapes within the same thermal absorption device.
    The thermal absorption device according to the invention comprises at least one second phase change material 14, different from the first phase change material 12 and which is arranged around at least one cell 8 of the network. The device comprises two sets of structures 8, one of which (the cells 8) is closed, the other (the passages 9) is open and interconnected, so as to allow a possible flow of phase-change material.
    The phase change materials 12, 14 are selected such that they change from the solid state to the liquid state upon thermal overload of the hot source.
    When this hot source is an electronic device, the first phase change material 12 and the second phase change material 14 are preferably selected so as to have respective melting temperatures within a normal operating range of this electronic device intended to be placed on the first face 4.
    The materials 12, 14 MCP may be chosen so as to have respective solid / liquid phase change (or melting) temperatures Tfi, Tf2, for example between 30 ° C and 250 ° C.
    Preferably, the second MCP material 14 is provided in the passages 9, with a melting temperature TF2 lower than that TFI of the first MCP material 12.
    According to one possible configuration, there is provided a first phase-change material 12 of organic nature, for example of the CxHy type, and which has a good affinity with the host structure, here in carbon nanotubes. In particular, an affinity in a liquid state of the phase change material is meant. In the case in particular where this host structure is in carbon nanotubes, the first phase-change material 12 may be a paraffin (CnH2n + 2), for example such as eicosane (C20H42).
    The second phase change material 14 may be organic or inorganic in nature and preferably selected so as to have good thermal conductivity. The second phase change material 14 may be in particular a metallic material such as for example InAg or InSnZn.
    A feature of the thermal absorption device is that in a same plane parallel to the first face 4 or the second face 6 (ie a plane parallel to the plane [0; x; y] in FIGS. 1A, 1B), several materials 12, 14 having different melting temperatures, are adapted to be able to implement a clipping or limitation of different respective heating undergone by different zones at the first face 4.
    Such a type of clipping proves useful in particular when the electronic device arranged on the first face 4 comprises several components having different operating ranges in power dissipated and / or different critical temperatures of operation.
    The second phase-change material 14 is here arranged in passages 9 situated between cells 8, that is to say in spaces delimited between side walls 10 of different cells 8. The passages 9 are separated from the channels 11 by the partitions in carbon nanotubes, preferably so that reservoirs respectively with first phase change material and second phase change material do not communicate with each other.
    The passages 9 have a critical dimension Δ2 (dimension measured parallel to the first face or plane [0; x; y]) which is greater than the critical dimension Δι of the channels 11. As will be seen later, this allows, when the manufacture of the device, to promote the filling of the channels 11 by the first material 12 MCP.
    In the exemplary embodiment illustrated in FIG. 1A, the arrangement of the passages 9 with respect to the cells 8 is such that a cell 8 provided with several channels 11 enclosing the first phase-change material 12 can be entirely surrounded by a passage 9 filled with the second phase change material 14. The passages 9 between cells 8 of the network can be connected to each other.
    We will now describe an example of a method of manufacturing a thermal absorption device according to the invention, the steps of which are shown diagrammatically in FIGS. 2A to 2H.
    In a first step, an array of cells 105 is made in a masking layer 103 deposited on one side of a support 101 and a lithography of the pattern to be carried out is carried out, for example by photolithography when the masking layer 103 is in photosensitive resin.
    In the case shown in Figure 2A, it is a honeycomb pattern with cells in the form of hexagonal blocks having vertical holes 105 through.
    In a next step (FIG. 2B), a catalyst 124 is deposited, for example by physical vapor deposition (PVD). The catalyst 124 is for example an iron layer or a bilayer system comprising a layer of alumina and an iron layer. The catalyst 124 is placed around the masking blocks, on the masking blocks and at the bottom of the vertical holes passing through these blocks.
    In a subsequent step, the masking 103 is removed, for example using a stripping process ("stripping" in the English terminology) when it is resin-based, the zones of Catalyst 124 arranged directly on the support 101 being preserved (FIG. 2C).
    In a next step, carbon nanotubes 128 are grown, in particular by chemical vapor phase deposition with a mixture C2H2, H2, He with respective gaseous flows of, for example, 10, 50, 50 cm3 / min. at a temperature of between 550 ° C. and 750 ° C., and a pressure of, for example, between 0.1 mbar and 10 mbar. The height of the nanotubes is fixed by the growth time and may be of the order for example of one or several hundred micrometers (FIG. 2D).
    In an advantageous subsequent step, the tubes can be compacted by immersion in an alcohol solution. During air drying, the nanotube walls collapse and form a dense material in which the nanotubes are in contact (Figure 2E).
    Thus, on the support 101 is formed an array of cells 8 or islands of carbon nanotubes comprising channels 11, the cells 8 being separated from each other by spaces or passages 9 delimited between side walls 10 of different cells 8.
    In subsequent steps (FIGS. 2F-2G) the channels 11 and the passages 9 are filled with different phase-change materials.
    An example of a filling method will now be given.
    In a first step (FIG. 2F) carried out at a temperature T1 such that T1> TF1, a first phase-change material 12 with a melting temperature TF1 is supplied in liquid form or melted on the carbon nanotube structure. Preferably, the first MCP material 12 has a high affinity with this host structure and in particular has a high wettability on the nanotubes and a low viscosity.
    By "significant" wettability, it is meant that a drop of the first MCP material 12 in a liquid state distributed on a carbon nanotube reception surface is such that the angle between the liquid surface and the solid surface in contact with the carbon nanotube is liquid is less than 60 ° and preferably 45 °.
    The first phase-change material 12 in liquid form enters by capillarity and moves preferentially in structures of smaller size, in particular in channels 11 of critical dimension Δι where the surface energy of the liquid is minimized.
    Indeed, the capillary pressure Pcap can be written in the form:
    with σ (J / m2): the surface tension of the liquid, Θ: the contact angle between the host structure and the liquid and 0.5Δ1 the radius of the channels 11 forming capillaries.
    Thus, when Θ is less than 90 °, the structure is said to be wetting and in this configuration the capillary pressure preferentially drives the liquid at the bottom of the channels 11 of critical dimension Δι rather than in the passages 9 of critical dimension Δ2. To allow a flow in the capillaries, a liquid of low viscosity, that is to say less than 1000 cP and advantageously between 1 and 10 cP, is chosen.
    The amount of the first phase change material 12 provided for filling is calculated so as to preferably fill only the volumes of the channels 11, while the spaces or passages 9 inter-cells 8 wider, are left empty after serving of transport path.
    The control of this filling is related to the quantity of phase-change material 12 which is introduced, this being provided by means of an estimate of the void rate of the host structure and in particular the volume of This estimate can be made using one or more images obtained for example by microscope of the empty cell network, and then a size calculation of the channels 11 from this or these images. An image analysis makes it possible to calculate a surface of vacuum then one multiplies this value by the height of the structure in order to estimate a volume. Once this volume is estimated, we deduce the mass of phase change material 12 to predict, MCP material 12 is weighed and then melted on the cell network.
    After filling the channels 11 with the first phase-change material 12, a surrounding temperature can be restored to the cell network 8 less than TF1 so that the first phase-change material returns to its solid state.
    Then, in a second step, the second phase change material 14 with a lower melting temperature TF2 than that of the first material 12 is disposed in liquid or molten form on the receiving structure.
    This process is carried out at a temperature T between the melting temperature TF2 of the second phase-change material and that TF1 of the first phase-change material, so as to make the second phase-change material 14 liquid or keep in the form of while maintaining the first phase change material 12 in its solid form. Thus, the second phase-change material 14 is introduced into the spaces or passages 9 between cells 8. The assembly thus obtained is a composite network formed of a thermally conductive structure, for example carbon nanotubes with one or more cells 8 having vertical channels 11 which extend in the direction of the nanotubes and are filled with the first phase change material 12 with solid state-liquid change temperature TF1, and at least one passage 9 between cells 8 filled with second phase-change material 14 TF2 solid-liquid state change temperature.
    The support 101 on which the nanotubes are built can be used to close a first end of the channels 11 and passages 9 filled with phase change material, while a second end can be closed using a cover 150 attached to the structure (Figure 2H). The cover 150 may be for example copper.
    The thermal absorption device can itself be transferred to an electronic device.
    In FIG. 3, a time-temperature curve Ci serves to illustrate the performances of a particular embodiment of the thermal absorption device. In this example, the first phase change material 12 is ΓΑ144 ™ developed by PCMPRODUCTS while the second phase change material 14 is InAg. The conductive host structure of carbon nanotubes is here closed by two copper plates disposed on an upper face and a lower face of the network. These plates form the first face and the second face of the thermal absorption device. The source, hot to which the device is here is contiguous, has a uniform dissipated power on the first face of the thermal absorption device which is of the order of 3 W / cm 2. For comparison, curves Cref (in broken lines) and Co are given. The Cref curve was obtained using a structure consisting of copper plates respectively disposed on an upper face and a lower face of a silicon wafer. The curve Co illustrates the performance of an absorption device formed of a carbon nanotube structure as described above in connection with FIGS. 1A-1B, but in which only one phase-change material is integrated. in the channels and the inter-cell passages.
    It can be seen that with the thermal absorption device according to the invention, the maximum temperature value is lowered compared to the case where only a phase change material is integrated.
    The second metallic phase change material 14 may have a density of about 8000 kg / m 3 while the first organic phase change material 12 may have a density of around 800 kg / m 3.
    However, if the latent heat of the second material 14 is 34 J / g compared to a first material 12 of 200 J / g then for the same available volume (for example 10 mm3), the energy that can store the first material 12 is 160 J while the energy that can store the second material 14 is 272 J.
    With the device incorporating several phase-change materials, therefore, better thermal clipping is achieved.
    A thermal absorption device according to the invention is particularly suitable for a non-uniform heat source that is to say whose power dissipated is not the same on the entire first face of the device.
    The device of FIG. 4 illustrates an arrangement with a hot source formed of elements having different respective thermal dissipations disposed on the same face of the thermal absorption device.
    The hot source comprises a first component (or a first chip) PI disposed on the first face 4 of the thermal absorption device and in particular on a passage forming a reservoir to the second phase-change material 14. A second component (or a second chip) P2 is also arranged on the channels 11 forming a reservoir to the first phase-change material 12. The first component PI and the second component P2 have different dissipated powers and / or critical temperatures of different operation. Thus each chip or electronic component is carried over a reservoir of phase change material dedicated to its own thermal clipping.
    The second component P2 that generates the most heat is carried over the cells 8 formed of conductive structures in nanotubes and vertical channels filled with the first phase-change material 12, while the first component PI which generates less heat is transferred to a surface located opposite the inter-cell passages 8 (inter-islands) filled with the second phase-change material 14.
    FIG. 5 serves to illustrate the performance of such a system in which the pair of MCP materials is provided with respective melting temperatures TF1, TF2 of the first phase change material and the second phase change material 12, 14 which differ from each other by at least 10 ° C.
    The time-temperature curves C n, C 21 are representative of measurements carried out respectively with a system as described above in which the second component P2 generates a heat flux of the order of 4 W / cm 2 while the first component PI generates a heat flux. of the order of lW / cm2.
    The melting temperatures TF1 and TF2 of the first phase change material 12 and the second phase change material 14 are respectively between 95-97 ° C and 85-87 ° C. For comparison, the curves C10, C20 are representative of measurements performed respectively on a system similar to that of Figure 4 but incorporating a single phase change material.
    In the example presented, we try to place ourselves in conditions such that the second component P2 (curves Cio and Cn) does not undergo a temperature of more than 110 ° C for more than 5 seconds and that the first component PI (curves C20 and C21) does not experience a temperature of more than 95 ° C for more than 10 seconds.
    The system configured with two phase change materials (curves C11 and C21) fulfills these criteria depending on the specifications of the PI, P2 components. On the other hand, the configuration with a single phase-change material (curves C10 and C20) does not allow it since the temperatures remain too high.
    In one or other of the embodiment examples which have just been described, two different PCM phase-change materials are integrated in two separate enclosures situated in the same plane parallel to the first face of the array of cells.
    It is also possible to integrate a number of phase change materials greater than two, taking into account, for example, the number of different components that it is desired to have on one face of the device.
    The embodiments which have just been given relate to a structure for accommodating phase change materials which is made of carbon nanotubes. A similar network structure made of another material, for example silicon, is not outside the scope of the present invention. In this case, the cells can be defined by a DRIE ("Deep Reactive Ion Etching" or "deep reactive ion etching") type etching process.
    The thermal absorption device with several phase-change materials according to the invention makes it possible to thermally manage transient or intermittent heat sources, and adapts in particular to 3D electronic devices, that is to say devices whose components are spread over 3 dimensions. Such devices are for example provided with several levels of superimposed transistors.
    权利要求:
    Claims (11)
    [1" id="c-fr-0001]
    1. Thermal absorption device comprising a first face (4) intended to be in contact with a hot source and a second face (6) opposite to the first face, an array of cells (8) filled with a first material to phase change (12) being disposed between the first face and the second face, at least a first cell and at least a second cell of the array being disposed in the same plane parallel to the first face, the first cell having a first side wall which extends between the first (4) face and the second face (6) while the second cell comprises at least a first side wall which extends between the first (4) face and the second face (6), the a cell array (8) being arranged such that a passage (9) is provided between the first side wall and the second side wall and that said passage (9) is filled with at least one second phase change material ( 14) different ent of the first phase change material (12).
    [2" id="c-fr-0002]
    2. Device according to claim 1, wherein the first side wall and the second side wall are formed of carbon nanotubes.
    [3" id="c-fr-0003]
    3. Device according to one of claims 1 or 2, wherein at least the first cell comprises a plurality of separate channels (11) which extend between the first (4) face and the second face (6) parallel to the first wall lateral.
    [4" id="c-fr-0004]
    4. Device according to one of claims 1 to 3, wherein the first phase change material (12) has a first melting temperature (TF1) and wherein the second phase change material (14) has a second melting temperature (TF2), the second melting temperature being lower than the first melting temperature (TF1).
    [5" id="c-fr-0005]
    5. Device according to one of claims 1 to 4, wherein the first phase change material is a paraffin.
    [6" id="c-fr-0006]
    6. Device according to one of claims 1 to 5, the second phase change material being metallic.
    [7" id="c-fr-0007]
    An electronic system comprising: at least one first electronic component (PI) forming a first heat source; at least one second electronic component (P2) forming a second heat source; at least one thermal absorption device according to one of claims 1 to 6, the first electronic component and the second electronic component being in thermal contact with the first face (4) of the thermal absorption device.
    [8" id="c-fr-0008]
    8. A method of manufacturing a thermal absorption device according to one of claims 1 to 6, comprising the steps of: a) filling at least a first cell and at least a second cell of the network with a first phase change material in its liquid state, b) filling a passageway between the first cell and the second cell with a second phase change material in its liquid state.
    [9" id="c-fr-0009]
    9. The method of claim 8, wherein the first cell comprises a plurality of separate channels (11), the channels having a critical dimension (Δι) less than a critical dimension (Δ2) of the passage between the first cell and a second cell.
    [10" id="c-fr-0010]
    The method according to one of claims 8 or 9, wherein the first phase change material (12) has a first melting temperature (TF1) greater than the melting temperature (TF2) of the second phase change material. (14), the filling being performed at a temperature below the melting temperature of the first phase change material.
    [11" id="c-fr-0011]
    11. Method according to one of claims 8 to 10, comprising prior to step a) steps of: - defining a pattern of the array of cells in a mask (103) formed on a support (101), and depositing a catalyst layer (124), then removing the masking, and then growing carbon nanotubes so as to define the cell network with side walls made of carbon nanotubes.
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    同族专利:
    公开号 | 公开日
    EP3182447B1|2018-07-25|
    US20170181318A1|2017-06-22|
    FR3046021B1|2017-12-22|
    US9936608B2|2018-04-03|
    EP3182447A1|2017-06-21|
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    2017-06-23| PLSC| Publication of the preliminary search report|Effective date: 20170623 |
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    优先权:
    申请号 | 申请日 | 专利标题
    FR1562602A|FR3046021B1|2015-12-17|2015-12-17|COMPOSITE THERMAL ABSORPTION DEVICE AND METHOD OF OBTAINING|FR1562602A| FR3046021B1|2015-12-17|2015-12-17|COMPOSITE THERMAL ABSORPTION DEVICE AND METHOD OF OBTAINING|
    US15/378,448| US9936608B2|2015-12-17|2016-12-14|Composite heat absorption device and method for obtaining same|
    EP16204780.7A| EP3182447B1|2015-12-17|2016-12-16|Composite heat-absorption device and method for obtaining same|
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